Second plasma etcher with cryo
PlasmaPro 100 Cobra 300 ICP
During fall of 2021 there will be one more plasma etcher with cryo stage and ICP installed in Albanova Nanolab.
The Oxford PlasmaPro 100 Cobra 300 is a load locked plasma etcher with a cryo stage. Maximum wafer size is 200 mm. Etch rate is > 8 um/min with a 3 kW ICP RF generator. Selectivity for photoresist is > 120 (general Bosch process).