Till innehåll på sidan

Flip chip bonder install and training Feb 22

Paroteq H-System die bonder
Publicerad 2018-01-15

Flip chip bonders are a useful tool for accurately aligning and bonding components

A flip-chip bonder from Paroteq suitable for small chips has been purchased by QNP and will be installed February 22nd. It is a versatile system with a good placement accuracy of 5 micrometer, but better with practice.

Questions to Thomas Lettner (lettner@kth.se).

See Paroteq website  for more info

Innehållsansvarig:Matthew Fielden
Tillhör: Albanova Nanolab
Senast ändrad: 2018-01-15