Flip chip bonder install and training Feb 22
Published Jan 15, 2018
Flip chip bonders are a useful tool for accurately aligning and bonding components
A flip-chip bonder from Paroteq suitable for small chips has been purchased by QNP and will be installed February 22nd. It is a versatile system with a good placement accuracy of 5 micrometer, but better with practice.
Questions to Thomas Lettner (lettner@kth.se).
See Paroteq website for more info