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Flip chip bonder install and training Feb 22

Paroteq H-System die bonder
Published Jan 15, 2018

Flip chip bonders are a useful tool for accurately aligning and bonding components

A flip-chip bonder from Paroteq suitable for small chips has been purchased by QNP and will be installed February 22nd. It is a versatile system with a good placement accuracy of 5 micrometer, but better with practice.

Questions to Thomas Lettner (

See Paroteq website  for more info

Page responsible:Matthew Fielden
Belongs to: Albanova Nanolab
Last changed: Jan 15, 2018